Operating mechanism: after heating plate heating, with a certain pressure, specific temperature and time, the transfer paper layer and thermal bonding to the substrate may penetrate to the substrate material.
(1) The use of micro-computer intelligent thermostat, time integration manipulator, high accuracy (temperature accuracy of ±0.5°c);
(2) hot wire and heating plate casting all, safe, with, and evenly distributed thermal;
(3) The heating plate is coated with Teflon-proof coating;
(4) Electronic time control, process completion signal alarm instructions;
(5) Pressure can be adjusted at will;
(6) The backplane installs the high temperature foaming silica gel board, the temperature-resistant 350°c does not deform.